Semiconductor et chip casibus & solutions

/ Semiconductor, et-chip, casibus, solutions /
/ Semiconductor, et-chip, casibus, solutions /
/ Semiconductor, et-chip, casibus, solutions /
/ Semiconductor, et-chip, casibus, solutions /

Liquid NITROGENIUM Refrigerant Systems sunt late in semiconductor & chip industria, comprehendo processus;

  • Et technology de M. trabem epitaxy (MBE)
  • Et Chip scriptor test post MANNUS Package

Related Products

Molecular trabem epitaxy

In technology de M. trabem epitaxy (MBE) erat developed in 1950s parare semiconductor tenuis film materiae usura vacuum evaporation technology. Cum progressionem de ultra-excelsum vacuo technology, applicationem de technology est extenditur in agro Semiconductor scientia.

HL est animadvertit postulatio MBE Liquid Nitrogen Refrigerant Ratio, Organized Technical Backbone ad feliciter develop specialis Mbe Liquid NITROGENIUM cooing ratio pro Mbe technology et integram paro of Vacuo, quae est in pluribus rebus, quae est in pluribus rebus, quae sunt in pluribus inquisitionis, quae est in pluribus rebus, quae est in pluribus rebus, quae est in multis rebus in rebus, quae est in multis rebus in multis rebus, quae est in pluribus conatibus, universities et investigationis institutorum .

Commune problems de semiconductor & chip industria includit,

  • In pressura liquiditatis nitrogen in terminalibus (Mbe) apparatu. Ne pressura cultro a deminutio terminatio (Mbe) apparatu.
  • Multiple Cryogenic liquor Instet et Outlet controls
  • In temperatus liquidum nitrogen in terminalibus apparatu
  • A rationabile moles cryogenic Gas emissiones
  • (Automatic) Switching de principalis et genere lineae
  • Pressura temperatio (reducendo) et stabilitas VIP
  • Purgato auferat possibile impudicitiis et glacies residuum ex tristique
  • Implens tempus terminatio liquido apparatu
  • Pipeline precoquoling
  • Liquid resistentiam in VIP ratio
  • Imperium damnum liquidae nitrogen durante discontinuous servitium ratio

HL scriptor vacuo insulatas pipe (VIP) constructum est ASME B31.3 pressura Piping Code ut a vexillum. Engineering experientia et qualis imperium facultatem ut efficientiam et cost-efficaciam de elit scriptor plant.

Solutions

HL Cryogenic apparatu praebet customers cum vacuo insulated limina system in occursum requisita et condiciones et Semiconductor & Chip Industry:

1.Quality Management System: Asme B31.3 pressura Piping Code.

2.A Special Phase SEPARATOR cum multiple cryogenic liquor in left et exitus cum ipso control munus occurrit exigentiam Gas emissionem, recycled liquidum nitrogen et temperatus liquido.

3.Adequate et opportune exhaurit consilio ensures quod terminatio apparatu semper operatur intra disposuerat pressura pretii.

4.The Gas-liquor obice ponitur in verticali vipe in fine VI Pipeline. Gas-liquida obice utitur ad Gas sigillum principium ad angustos ad calorem a fine vi Pipeline in VI pulsae, et efficaciter reducere damnum liquidam NITROGENIUM durante discontinue et intermittendi servitium in systogen.

5.vi Piping regitur per vacuum insulated valvae (viv) Series: possidet vacuo insulated (pneumatic) clausa-off valvae, Vacuum adoliaceam etc. Vap Vip requiritur. Vivitur in vip prefabrication in manufacturer, sine on-site insulatas curatio. Sigillum unitatis vivit vivit facile. (HL accipit in cryogenic valvae notam designatur a customers, et facit vacuo insulatas valvulae ab HL. Quidam brands et exempla de valvulae non potest esse in vacuo insulatas valvulae.)

6Cleanless, si sunt additional requisita pro interiore fistulam superficiem munditiam. Hoc est suggesserant, ut teloneariorum elige BA aut eptainless ferro tibiales sicut VIP interioris tibia ad adhuc redigendum immaculatam ferro PolfeGe.

7.Vacuum insulated filter, emundare auferetur possibile impudicitiis et glacies residuum ex tristique.

8.After paucis diebus et iam shutdown aut sustentationem, quod est valde necessaria ad Precool Piping et Terminatio apparatu ante cryogenic liquidum, ut vitare VI esca post cryogenic liquido directe intrat VI pulsu et terminatio apparatu. Praechooling munus debet considerari consilio. Non providet melius tutela ad terminatio apparatu et VI pavonum sustentationem apparatu ut valvulae.

9.Suit enim tam dynamic et stabilis vacuo insulated (flexibilia) limbis ratio.

10.dynynamic vacuo insulated (flexibilia) et plantabunt systemate: consistit de VI flexibilia exercituum et / vel VI pipe, thoracem heses, vacuum vacuum systematis (including in vacuo Pumps etc. ). Longitudo unius VI flexibile caligarum potest customized secundum user scriptor elit.

11.Various Connection Genera: Vacuum Bayonet Connection (VBC) Type et Welded Connection potest electus. VBC Type non opus in-site insulatas curatio.


Relinque nuntium