Ante chip folia fabrica, ut indiget missum ad professionalem packaging et testis factory (ultima test). A magna sarcina & test Factory habet centum vel millia of test machinis, eu in test machina ad altum et humilis temperatus inspectionem, nisi pertransit per chip potest ad elit.

In chip necessitates ad experimentum operating status ad altum temperatus magis quam C gradus Celsius, et test machina cito reducit temperatus ad infra nulla pro multis reciprocating probat. Quia compressors non capaces talis celeri refrigerationem, liquidum nitrogen opus est, una cum vacuo insulated limbis et phase separator ut libera eam.

Hoc test est crucial pro semiconductor eu. Quod munus non est applicationem de semiconductor chip princeps et humilis temperatus humidum calefacere camera ludere in test processus?

I. Reliability taxationem: High et humilis temperatus infectum et scelerisque probat potest simulare usum Semiconductor eu in extrema environmental conditionibus, ut maxime altum temperatus et thermirdments. Per condiciones per condiciones probat, quod potest assess reliability chip durante diu terminus usum determinare operating fines diversis ambitibus.

II. Euismod Analysis: Mutationes in temperatus et humiditas ut afficit electrica characteres et perficientur de semiconductor eu. High and low temperature wet and thermal tests can be used to evaluate the performance of the chip under different temperature and humidity conditions, including power consumption, response time, current leakage, etc. This helps to understand the performance changes of the chip in different working environments, and provides a reference for product design and optimization.

III. Diuturnitatem Analysis: et expansion et contractio processus of semiconductor chips sub conditionibus temperatus exolvuntur et humidum calefacere cycle potest ducere ad materiam lassitudine, contactus problems et de-solidatorium problems. High et humilis temperatus infectum et scelerisque probat potest simulare haec passiones et mutationes et auxilium aestimare diuturnitatem et stabilitatem de chip. Per deprehendentes chip euismod degradation sub cyclic conditionibus, potentiale problems potest idem in antecessum et consilium et vestibulum processus potest melius.

IV. Qualitas imperium: altum et humilis temperatus infectum et scelerisque test est late in qualis imperium processus of semiconductor eu. Per stricte temperatus et humiditas exolvuntur test de chip, chip quod non occurrit requisita potest esse obiecten ad curare consistency et reliability de productum. Hoc adjuvat ad redigendum ad defectum rate et sustentacionem rate de productum, et amplio qualitas et reliability de productum.

HL Cryogenic Equipment

HL Cryogenic apparatu, qui in MCMXCII est notam foederata ad HL cryogenic apparatu turba cryogenic apparatu Co., Ltd. HL cryogenic apparatu committitur ad consilium et artifices in excelsum vacuo insulatas cryogenic pavoris system et related Support apparatu ad occursum variis necessitatibus customers. The Vacuum Insulated Pipe and Flexible Hose are constructed in a high vacuum and multi-layer multi-screen special insulated materials, and passes through a series of extremely strict technical treatments and high vacuum treatment, which is used for transferring of liquid oxygen, liquid nitrogen, liquid argon, liquid hydrogen, liquid helium, liquefied ethylene gas LEG and liquefied nature gas LNG.

Quod productum seriem vacuo valvae, vacuum pipe, vacuo caligarum et phase separator in HL cryogenic apparatu turma, quae per a series maxime stricta technica, liquido ad transportandam et dewar etc., et helium et dewar etc.) in Industries Electronics, superconductor, chips, MBE, pharmacy, biobank / cellbank, cibum & potum, automation ecclesia et scientificae etc.